nubia has launched its first-ever tablet - the nubia Pad Pro. Designed to meet the growing demands of users across work, study, and entertainment, the nubia Pad Pro delivers a high-performance experience powered by the Qualcomm Snapdragon 8 Gen 3 processor, featuring a Prime Cortex-4 clock speed at up to 3.3 GHz.

It's equipped with LPDDR5X high-speed memory and UFS4.0 flash storage, ensuring smooth multitasking capabilities and fast load times across applications. The nubia Pad Pro features a 10.9-inch 2.8K ultra-clear true-color screen with a resolution of 2880×1800, offering vivid visuals and accurate color reproduction. For audio, it supports DTS X Ultra spatial 3D sound, creating an immersive stereo experience ideal for entertainment and content consumption.

TrendForce's latest investigations find that DDR4 contract prices for servers and PCs are expected to rise more sharply in the second quarter of 2025 due to two key factors: major DRAM suppliers scaling back DDR4 production and buyers accelerating procurement ahead of U.S. tariff changes. As a result, server DDR4 contract prices are forecast to rise by 18-23% QoQ, while PC DDR4 prices are projected to increase by 13-18%—both surpassing earlier estimates.

TrendForce notes that DDR4 has been in the market for over a decade, and demand is increasingly shifting toward DDR5. Given the significantly higher profit margins for HBM, DDR5, and LPDDR5(X), suppliers have laid out EOL plans for DDR4, with final shipments expected by early 2026. Current EOL notifications largely target server and PC clients, while consumer DRAM (mainly DDR4) remains in production due to continued mainstream demand.

Micron Technology, Inc. (Nasdaq: MU), announced today that it is shipping qualification samples of the world's first 1γ (1-gamma) node-based low-power double data rate 5X (LPDDR5X) memory, designed to accelerate AI applications on flagship smartphones. Delivering the industry's fastest LPDDR5X speed grade of 10.7 gigabits per second (Gbps), combined with up to a 20% power savings, Micron LPDDR5X transforms smartphones with faster, smoother mobile experiences and longer battery life - even when executing data-intensive workloads such as AI-powered translation or image generation.

To meet the industry's increasing demand for compact solutions for next-generation smartphone designs, Micron's engineers have shrunk the LPDDR5X package size to offer the industry's thinnest package of 0.61 millimeters, making it 6% thinner compared to competitive offerings, and representing a 14% height reduction from the previous generation. The small form factor unlocks more possibilities for smartphone manufacturers to design ultrathin or foldable smartphones.

Minix is launching new Mini PCs in May, designed to simplify digital life. To show our appreciation for customers' support, Minix offers exclusive discounts on popular products, including Wireless Display Series, GaN PD Charger Series, CarPlay Adapters, Mini PCs, and Portable Monitors. These offers will be available until June 3rd.

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SK hynix presented its leading memory solutions optimized for AI servers and AI PCs at Dell Technologies World (DTW) 2025 in Las Vegas from May 19-22. Hosted by Dell Technologies, DTW is an annual conference which introduces future technology trends. In line with DTW 2025's theme of "Accelerate from Ideas to Innovation," a wide range of products and technologies aimed at driving AI innovation was showcased at the event.

Based on its close partnership with Dell, SK hynix has participated in the event every year to reinforce its leadership in AI. This year, the company organized its booth into six sections: HBM, CMM (CXL Memory Module)-DDR5, server DRAM, PC DRAM, eSSDs, and cSSDs. Featuring products with strong competitiveness across all areas of DRAM and NAND flash for the AI server, storage and PC markets, the booth garnered strong attention from visitors.

Powered by NVIDIA Blackwell, GeForce RTX 50 Series laptops bring game-changing capabilities to gamers and creators. Multiply performance with NVIDIA DLSS 4 Multi Frame Generation, generate images at unprecedented speed, power through work, unleash your creativity with NVIDIA Studio apps, and use AI innovations on the go in the thinnest and longest-lasting RTX laptops yet, optimized by our newest Max-Q technologies. Now, there are even more options for people wanting access to the latest innovations in a mobile form factor with the launch of GeForce RTX 5060 Laptop GPUs available in new models from every major manufacturer, starting at $1099.

These laptops are as thin as 14.9 mm, give gamers double the performance of the previous generation with the power of NVIDIA Blackwell and DLSS 4, and enable 100+ FPS in your favorite games. Creators can leverage the latest AI advancements to accelerate creative workflows. Students can accelerate performance in apps used in engineering, architecture, computer science, data science, economics, and more. Play, create, and work longer on battery thanks to Blackwell innovations and Max-Q power optimization.

MSI at the 2025 Computex showcased is EdgeXpert MS-C931, a personal AI supercomputer powered by the NVIDIA DGX Spark platform. This NUC-sized box packs an NVIDIA "Grace Blackwell" GB10 superchip with NVLink-C2C interconnect for cache coherency between the CPU and GPU; 128 GB of unified LPDDR5X memory, 200 Gbps InfiniBand networking, and compute performance of up to 1,000 AI TOPS, for AI-native code development without having to leverage the cloud. The company also showed off its Modern AM273QP AI, an all-in-one desktop powered by Intel Core Ultra "Meteor Lake" processors. The AIO comes with a 27-inch 1440p display. Other features include Thunderbolt 4, and hot-swap M.2 NVMe SSD capability.

GIGABYTE at the 2025 Computex showed off the AI TOP Atom, a custom-design NVIDIA DGX Spark box. NVIDIA earlier today announced that it had opened up the DGX Spark compact AI supercomputer for custom designs, and the AI TOP Atom is one of many such custom designs. The box combines an NVIDIA GB10 "Grace Blackwell" GPU+CPU combo, with 128 GB of unified LPDDR5X memory, NVLink chip-to-chip interconnect for full memory/cache coherence, and a high bandwidth ConnectX-7 InfiniBand NIC letting you stack up additional DGX Spark boxes. The box offers up to 1,000 AI TOPS of compute power and is able to accelerate 70B and 200B parameter models. It's designed for AI-native localized software development.

Acer today announced new models in its Swift X laptop series, the Swift X 14 AI and Swift X 14, designed to offer professionals and content creators reliable performance and a suite of AI tools to enhance their creative endeavors. Powered by AMD Ryzen AI 300 Series processors, the Swift X 14 AI enables seamless on-device rendering, modeling, and real-time visualization. This new Copilot+ PC is equipped to handle demanding AI workloads and offers exclusive AI experiences such as Recall (preview), Click to Do (preview), and improved Windows search, Cocreator, Live Captions, Image Creator, and Windows Studio Effects. The new Swift X 14 creator laptop ensures responsive performance for demanding creative workflows and all-day battery life powered by Intel Core Ultra Processors (Series 2).

Both laptops are powered by NVIDIA GeForce RTX 5070 Laptop GPUs with NVIDIA Blackwell architecture and also feature Calman-verified 3K OLED touch displays that are calibrated to produce captivating and accurate colors right out of the box.

Acer today unveiled updates to the family of Swift thin-and-light Copilot+ PCs - the Swift Edge 14 AI and Swift Go AI Series - which are now powered by the latest Intel Core Ultra 200V Series processors with integrated Neural Processing Units (NPU). Featuring premium, portable designs, the new laptops include the technology and features needed for creativity and productivity, along with up to OLED displays to present standout color accuracy and details.

The new Swift Copilot+ PCs boast NPUs that perform over 40 TOPS and are equipped to run the most demanding AI workloads and offer exclusive AI experiences such as Recall (preview), Click to Do (preview), and improved Windows search, Cocreator, Live Captions, and Windows Studio Effects. In addition, they also feature a dedicated Copilot key to launch Copilot in Windows 11 with a single touch.

With the launch scheduled for June 5, Nintendo has quietly confirmed the final technical details for its next-generation hybrid console, the Switch 2, clarifying the specifications of the "custom NVIDIA processor" at its core and specifying exactly how much horsepower developers can access. The Switch 2's SoC is officially labeled the NVIDIA T239, a custom iteration of the Ampere architecture rather than a repurposed Tegra. It contains eight Arm Cortex‑A78C cores running a 64‑bit ARMv8 instruction set, with cryptography extensions enabled and no support for 32‑bit code. Each core features 64 KB of L1 instruction cache and 64 KB of L1 data cache. Six cores are available for game development, while two are reserved for system tasks. Clock speeds reach 998 MHz in handheld mode and 1,101 MHz when docked, and the CPU can theoretically burst to 1,700 MHz for demanding operations or future updates.

Graphics are powered by a full Ampere‑based GPU with 1,536 CUDA cores. Clock speeds top out at 1,007 MHz in docked mode and 561 MHz in handheld mode, delivering approximately 3.07 TeraFLOPS when docked and 1.71 TeraFLOPS in portable use. As with the CPU, a portion of GPU resources is allocated to operating system functions, slightly reducing the amount available for applications. Memory capacity has increased from 4 GB of LPDDR4 in the original Switch to 12 GB of LPDDR5X in the new model, split across two 6 GB modules. Peak bandwidth measures 102 GB/s docked and 68 GB/s handheld. Of the total, 3 GB are reserved for system functions and 9 GB are dedicated to games and applications. Nintendo has also introduced a dedicated File Decompression Engine for LZ4‑compressed data, offloading asset unpacking from the CPU to improve loading times without overheating the chipset. The console ships with 256 GB of UFS storage, expandable via microSD Express up to 2 TB, and features a 7.9‑inch, 1080p LCD that supports HDR10 and up to 120 Hz variable refresh rate in handheld mode. Although HDMI VRR is not yet available, the internal display fully supports it.

Dell 16 Plus laptops with AMD's latest Ryzen AI processors were silently listed on the company website. This thin laptop has an Ice Blue aluminium body (bezel and the palmrest are plastic) giving it a nice look while staying practical at 16.99 mm thick and 1.83 kg. Inside, the Dell 16 Plus runs on AMD's 8-core Ryzen AI 7 350 Processor (50 TOPS NPU, 8 cores, up to 5.0 GHz) helped by 16 GB or 32 GB LPDDR5X 7500 MT/s memory and 1 TB SSD storage. The 16-inch screen has a 16:10 ratio with FHD+ (1920 x 1200) resolution, 300 nits, touch support and ComfortView technology. The backlit keyboard includes a numpad and a Copilot key for those who really need it.

The Dell 16 Plus packs plenty of ports into its thin frame. You'll find two USB-C 3.2 slots that support Power Delivery and DisplayPort, one USB 3.2 Type-A port, HDMI, and audio jack. For wireless, it has the MediaTek MT7925 Wi-Fi 7 and Bluetooth. A 4-cell 64WHr battery and 65 W Type-C charger keep you powered up all day while the power button doubles as a fingerprint reader. Last but not least, it has a 1080p @ 30 FPS FHD camera with dual-array microphones, and 2x2.5 W stereo speakers with Realtek SounzReal and Dolby Atmos support.

Cadence today announced it is furthering its longstanding collaboration with TSMC to accelerate time to silicon for 3D-IC and advanced-node technologies through certified design flows, silicon-proven IP and ongoing technology collaboration. As a leading provider of IP for TSMC N2P, N5 and N3 process nodes, Cadence continues to deliver cutting-edge AI-driven design solutions to the TSMC ecosystem for multiple horizontal applications from chiplets and SoCs to advanced packaging and 3D-ICs. The deep collaboration encompasses certified tools and flows for TSMC's N2P and A16 technologies, paves the way for TSMC's A14 and further unlocks 3D-IC possibilities by extending support for TSMC 3DFabric design and packaging. In addition, Cadence and TSMC are extending tool certification for newly announced TSMC N3C technology based on available N3P design solutions.

Cadence is driving innovation in AI chip design with certified tools and optimized IP for TSMC's advanced N2P and A16 process technologies. Reinforcing its memory IP leadership, Cadence offers TSMC9000 pre-silicon-certified DDR5 12.8G IP for N2P. Cadence digital, custom/analog design and thermal analysis solutions are certified for TSMC N2P and A16 technologies. Combined with continued collaboration on AI-driven digital design solutions for N2P, including leveraging large language models (LLMs), these advancements play an important role in improving digital design flows for future process nodes.

Qualcomm aims to boost the performance of its Windows‑on‑Arm PC chips by about 18-22% percent with the next‑generation Snapdragon X2 processors. That estimate comes from Focused Digital, a well‑known Chinese blogger often leaks supply‑chain details. He says these new Snapdragon X2 chips will hit boost clocks of around 4.40 GHz, which is up from the 4.0 to 4.30 GHz range we see on today's Snapdragon X Elite models. Currently, those Elite chips use Oryon cores built on the TSMC 4 nm‑class N4P process. They run between 3.0 and 3.80 GHz at base and can turbo up to 4.30 GHz. So, simply cranking the top speed up another 100 MHz could explain a chunk of that performance jump. Beyond clocks, Qualcomm is probably squeezing more efficiency out of its Oryon V3 microarchitecture too, though we don't have details yet.

We also don't know exactly which process node Qualcomm will pick. They could stick with a refined 4 nm variant or switch to 3 nm later on. Either way, a roughly 20 percent improvement aligns with what you'd expect from a new generation of chips due in 2025. Another rumor floating around is that the X2 Elite series will jump from 12 to 18 cores, giving the processors more parallel horsepower. Internal test rigs reportedly pair these chips with up to 48 GB of LPDDR5X RAM and 1 TB of NVMe storage. Qualcomm rolled out its first Snapdragon X Elite processors in mid‑2024 and began testing the SC8480XP prototype in September 2024. If these performance figures hold up, the new Snapdragon X2 lineup could close the gap on x86 competitors and set Qualcomm up nicely for competing in stronger with a push in the PC segment by 2026.

A few months ago, the OneXPlayer X1 Pro gaming handheld became one of the first in its category to boast AMD's 12-core Ryzen AI HX 370 'Strix Point' APU. The product also packed a pretty large 10.95-inch 120 Hz, 2560 x 1600 display as well as up to 64 GB of memory and a whopping 4 TB of internal solid-state storage. Now, the company behind the product has introduced a fresh new limited-edition variant named 'EVA' with a Neon Genesis-based theme and Arrow Lake-H internals. To be specific, this variant will boast Intel's Core Ultra 7 255H processor along with an eye-watering $1650 price tag.

The 16-core Core Ultra 7 255H will be paired with 64 GB of LPDDR5X memory, and 2 TB of SSD storage will be on offer. Unlike the AMD-powered variant, lower-end SKUs with 32 GB of memory and lesser storage space are not available. In terms of performance, the systems are quite neck-and-neck, which makes sense considering that the equivalent configurations are priced identically. The AMD APU has the lead in multicore performance, while the Intel part leads in single-core. In terms of GPU performance, the Arc 140T is quite a bit faster than the Radeon 890M, at least in synthetic tests. Real-life gaming performance is very similar, although performance varies heavily depending on the game being played.

Late last month, speculative Snapdragon 8 Elite Gen 2 (aka SM8850) technical details emerged online. Up until then, Digital Chat Station's Weibo channel has delivered all sorts of pre-release information—mostly concentrating on Qualcomm's alleged redeployment of a familiar "2 + 6" core configuration, and selection of TSMC's 3 nm "N3P" node process. Earlier today, the veteran leaker predicted a couple of new-gen improvements—first concentrating on the alleged mobile chipset's "Adreno 840" integrated graphics solution. Digital Chat Station (DCS) believes that the company's engineering team has increased their iGPU design's independent cache size "from 12 MB to 16 MB," leading to: "early setting performance increased by 30%±." It is not clear whether this rumored upgrade has affected the SoC's L2 or L3 cache provisions, but the current-gen Snapdragon 8 Elite mobile processor makes do with 12 MB of L2 cache per cluster. Additionally, DCS reckons that an enlargement of caches has resulted in performance of Qualcomm's "second-generation self-developed CPU architecture" increasing "by 25%±."

As interpreted by Wccftech: "the upcoming SoC will now feature 32 MB of L2 cache, with the L3 count currently unknown at this time. The initial test results revealed that the 'Snapdragon 8 Elite Gen 2' delivered a 30 percent performance increase, but it is unconfirmed if this delta exists between the Snapdragon 8 Elite or some other silicon." DCS has heard whispers about the upcoming chip supporting "new generations of high-speed LPDDR5X/LPDDR6" memory. The mentioning of LPDDR5X is not surprising; given that the current Snapdragon 8 Elite model is already up to snuff with this spec. Just over a year ago, JEDEC was reportedly working on the finalization of LPDDR6 standards for mobile platforms. Shortly thereafter, smartphone industry watchdogs started to theorize about the arrival of a so-called "Snapdragon 8 Gen 4" chip with LPDDR6 RAM in 2025. Fast-forward to the present day; fresh reports suggest that manufacturers will have the option to outfit next-gen flagship devices with "bog-standard" LPDDR5X or faster/more efficient LPDDR6 memory.

Over the past weekend, GMKtec's Weibo channel announced that pre-orders for its recently unveiled EVO-X2 mini PC model will start on April 7 (through JD.com), for customers located in China. Almost two weeks ago, the manufacturer boasted about its brand-new offering being the "world's first AI mini PC" equipped with AMD's Ryzen AI "Strix Halo" Max+ 395 APU. Extra international attention was gained, due to Lisa Su's autographing of a showcased unit during proceedings at the 2025 AI PC Innovation Summit (held on March 18, in Beijing). Pricing and availability were not mentioned during this press event, but GMKtec's Saturday (March 29) bulletin has revealed a (roughly) $2067 USD price point for the EVO-X2 launch model.

The manufacturer's blog entry stated that the: "EVO-X2 AI supercomputing host is coming, 128 GB + 2 TB priced at 14999 yuan, pricing reconstructs the desktop computing power boundary! Equipped with AMD Ryzen AI Max+ 395 flagship processor, 16-core 32-thread architecture with 5.1 GHz acceleration frequency, combined with 128 GB LPDDR5X memory and 2 TB high-speed storage, it can realize local deployment of 70 billion parameter large models, and AI performance exceeds NVIDIA's GeForce RTX 5090D graphics card." This potent compact AI-crunching solution is tempered by GMKtec's "innovative" Arctic Ocean cooling system. They advertise this design as using: "dual-turbofans and VC heat sinks to achieve silent heat dissipation at a peak power consumption of 140 W. The body adopts a recycled aluminium suspension design, equipped with HDMI, DP and USB4 interfaces, and supports Wi-Fi 6 + 2.5G network access." The brand has not yet announced an international release, but their EVO-X2 mini PC could face serious competition. Late last month, Framework debuted its Desktop product range—consisting of configurable 4.5L Mini-ITX systems—with a top-end Ryzen AI Max+ 395 (128 GB) model starting at $1999.

TrendForce's latest findings reveal that U.S. tariff hikes prompted most downstream brands to frontload shipments to 1Q25, accelerating inventory reduction across the memory supply chain. Looking ahead to the second quarter, conventional DRAM prices are expected to decline by just 0-5% QoQ, while average DRAM pricing including HBM is forecast to rise by 3-8%, driven by increasing shipments of HBM3e 12hi.

PC and server DRAM prices to hold steady
In response to potential U.S. tariff hikes, major PC OEMs are requesting ODMs to increase production, accelerating DRAM depletion in their inventories. OEMs with lower inventory levels may raise procurement from suppliers in Q2 to ensure stable DRAM supply for the second half of 2025.

Today marks the launch of ASUS Vivobook S14/S16 (S3407QA/S3607QA), a pair of Copilot+ PCs engineered to be the ideal companions for everyday life.

Featuring the latest high-performance Snapdragon X processor with up to 45 TOPS NPU, these ultra-slim, lightweight laptops deliver powerful AI capabilities, extended battery life, and next-level connectivity. For work, study, or play, Vivobook S14/S16 provide an immersive entertainment experience with stunning 16:10 FHD OLED or 2.5K 144 Hz IPS displays, along with Snapdragon Sound and Dolby Atmos audio. Designed for style and durability, these devices ensure effortless AI computing with premium metallic chassis, military-grade resilience, and advanced security features for total peace of mind.

At MWC 2025, Lenovo unveils its latest portfolio of AI-powered business devices, featuring next-generation ThinkPad and ThinkBook laptops, expanded software and recent ThinkShield security solutions, and showcases visionary proof-of-concept innovations. Designed to enhance productivity, personalization, and business protection, these new devices integrate AI-driven computing, flexible form factors, and enterprise security solutions to meet the evolving demands of professionals and hybrid workers.

"AI is fundamentally transforming how businesses operate, and at Lenovo, we are committed to delivering smarter, more secure, and more adaptable solutions that empower professionals in today's fast-evolving workplace. Our latest ThinkPad and ThinkBook innovations leverage AI to enhance productivity, streamline IT management, and provide more secure and seamless hybrid work experiences," said Eric Yu, SVP of SMB and Commercial Product Center, Lenovo Intelligent Devices Group. "The ThinkBook codename Flip AI PC Concept exemplifies our vision for the future—where AI-powered devices drive efficiency, personalization, and collaboration like never before. With our expanding portfolio of AI-integrated business devices and intelligent IT solutions, Lenovo is helping organizations to harness the power of AI in an ever-changing world."

According to South Korea's Money Today, SK hynix is currently engaged in the development of yet another variation of LPDDR5. The mega supplier of DRAM and flash memory chips has publicly disclosed its LPDDR5 Turbo (T) design—going back to late 2023; this iteration was advertised as the "world's fastest mobile memory standard." The first public demonstration of LPDDR5T (10533) was performed at last February's IEEE Solid State Circuit Conference. Currently, the familiar LPDDR5X standard is prevalent throughout commercial channels. Insiders believe that a proposed new "LPDDR5M" design will be released as a lower power alternative to LPDDR5X.

Insiders reckon that the unannounced LPDDR5M standard operates at lower voltages (reportedly 0.98 V), when compared to current offerings (X: 1.05 V). Given the nature of its acronym—Low Power Double Data Rate—this memory type was first devised with efficient operations in mind; ideal for mobile applications. An industry mole proposes that internal company discussions have highlighted a key percentage difference: "at maximum speed, LPDDR5M is ~8% more power efficient than LPDDR5X." The recent Money Today SK news article mentions that older LPDDR4 standards are classed as "legacy products" by company leadership. In contrast, LPDDR5 variants are (allegedly) categorized as "high value-added products." The rumored addition of LPDDR5M is viewed—by regional memory industry watchdogs—as a fortification (and diversification) of SK hynix's strategy; that already encompasses LPDDR5X and LPDDR5T. Tipsters posit that LPDDR5M memory is destined to feature inside next-gen smartphone devices with on-board AI capabilities.

Today, we introduced the Framework Desktop, a tiny 4.5L Mini-ITX desktop powered by AMD's massive new Ryzen AI Max processors. Pre-orders are open now, with first shipments in early Q3 2025. When AMD shared the Ryzen AI Max with us, we immediately knew we had to use it. It has up to 16 CPU cores at 5.1 GHz boost clock, discrete-level Radeon 8060S graphics, and support for up to an insane 128 GB of unified LPDDR5x. That enables 1440p or higher gaming on the heaviest titles, big creative and workstation workloads, and true local AI use cases. This is an absolute monster of a processor, and we shifted our roadmap a year ago to make space for it. In a desktop form factor, we get to unlock every bit of its performance with 120 W sustained power and 140 W boost while staying quiet and cool.

You may still be wondering, why does Framework need to build a desktop? Aren't desktops already modular and upgradeable? They are. In fact, the desktop PC ethos is part of what inspired the Framework Laptop to begin with. The desktop world is amazing. There is a broad, long-lived, interoperable ecosystem with hundreds of brands and hundreds of millions of consumers participating. You can build, upgrade, repair, and personalize to the limits of your imagination (and budget, and desk space), and share your amazing creations with all of the other true believers. We want to make this space as accessible as we possibly can by building a desktop that is simultaneously small and simple and incredibly powerful and customizable. Everyone should have the opportunity to experience the culture around PCs and PC gaming first-hand.

Micron Technology, Inc., today announced it is the first in the industry to ship samples of its 1γ (1-gamma), sixth-generation (10 nm-class) DRAM node-based DDR5 memory designed for next-generation CPUs to ecosystem partners and select customers. This 1γ DRAM milestone builds on Micron's previous 1α (1-alpha) and 1β (1-beta) DRAM node leadership to deliver innovations that will power future computing platforms from the cloud to industrial and consumer applications to Edge AI devices like AI PCs, smartphones and automobiles. The Micron 1γ DRAM node will first be leveraged in its 16 Gb DDR5 DRAM and over time will be integrated across Micron's memory portfolio to meet the industry's accelerating demand for high-performance, energy-efficient memory solutions for AI. Designed to offer speed capabilities of up to 9200 MT/s, the 16 Gb DDR5 product provides up to a 15% speed increase and over 20% power reduction compared to its predecessor.

AMD's "Strix Halo" APU, marketed as Ryzen AI Max+, has just been exposed in die-shot analysis. Confirming the processor's triple-die architecture, the package showcases a total silicon footprint of 441.72 mm² that integrates advanced CPU, GPU, and AI acceleration capabilities within a single package. The processor's architecture centers on two 67.07 mm² CPU CCDs, each housing eight Zen 5 cores with a dedicated 8 MB L2 cache. A substantial 307.58 mm² I/O complements these die that houses an RDNA 3.5-based integrated GPU featuring 40 CUs and AMD's XDNA 2 NPU. The memory subsystem demonstrates a 256-bit LPDDR5X interface capable of delivering 256 GB/s bandwidth, supported by 32 MB of strategically placed Last Level Cache to optimize data throughput.

The die shots reveal notable optimizations for mobile deployment, including shortened die-to-die interfaces that reduce the interconnect distance by 2 mm compared to desktop implementations. Some through-silicon via structures are present, which suggest potential compatibility with AMD's 3D V-Cache technology, though the company has not officially confirmed plans for such implementations. The I/O die integrates comprehensive connectivity options, including PCIe 4.0 x16 lanes and USB4 support, while also housing dedicated media engines with full AV1 codec support. Initial deployments of the Strix Halo APU will commence with the ASUS ROG Flow Z13 launch on February 25, marking the beginning of what AMD anticipates will be broad adoption across premium mobile computing platforms.

ASUS Republic of Gamers (ROG) announced that the 2025 ROG Flow Z13 is now available for pre-order. This versatile gaming 2-in-1 can feature up to AMD's newest AMD Ryzen AI Max+ 395 Processor with Radeon 8060S Graphics and a unified memory structure, allowing for incredible performance and power efficiency. A new stainless steel and copper vapor chamber, larger intake vents, and 2nd Gen Arc Flow Fans offer 70% more airflow for quiet and efficient cooling.

This 13-inch tablet boasts a stunning ROG Nebula Display, a 2.5K resolution 180 Hz touchscreen with 500 nits of peak brightness, and Corning Gorilla Glass 5 protection. The Flow Z13 now also features a larger 70Wh battery, a larger touchpad and keycaps, and a convenient Command Center button for quick access to vital system functions. With dual USB-C ports, both of which support USB4 and power delivery, as well as a dedicated HDMI 2.1 port, the Flow Z13 lets gamers leave their dongles at home.