Taiwanese electronics manufacturer Wistron announced on Friday that its new U.S. manufacturing facilities for NVIDIA will be ready next year, confirming they're in discussions with other potential customers as well, Reuters reports. Wistron CEO Jeff Lin made his first public statement since NVIDIA's announcement, saying, "All our progress will follow the customer's lead," and confirmed their timeline aligns with NVIDIA's expectations. The facilities will partly support NVIDIA's ambitious plan to build AI servers worth up to $500 billion in the U.S. over the next four years. NVIDIA revealed in April its strategy to establish supercomputer manufacturing plants in Texas, collaborating with Foxconn in Houston and Wistron in Dallas, with both locations expected to increase production within 12-15 months. Recently Wistron's board has approved a $500 million investment in its new U.S. subsidiary.

The facilities will focus on producing high-performance computing and AI-related products, though Lin declined to name the other companies they're in talks with. When asked about U.S. restrictions on advanced chip exports to China, Lin noted that demand outside China remains robust. "We expect to grow alongside our customers... As for developments in the Middle East, most of them are essentially our indirect customers," he added. This comes as the UAE and U.S. signed an agreement this week to build the largest AI campus outside America, potentially involving the purchase of 500,000 of NVIDIA's most advanced AI chips yearly starting in 2025. Wistron also mentioned it's considering moving notebook production in Mexico in an attempt to avoid tariffs under the United States-Mexico-Canada trade agreement.

AMD and HUMAIN, Saudi Arabia's new AI enterprise, today announced a landmark agreement to build the world's most open, scalable, resilient, and cost-efficient AI infrastructure, that will power the future of global intelligence through a network of AMD-based AI computing centers stretching from the Kingdom of Saudi Arabia to the United States. As part of the agreement, the parties will invest up to $10B to deploy 500 megawatts of AI compute capacity over the next five years. The AI superstructure built by AMD and HUMAIN will be open by design, accessible at scale, and optimized to power AI workloads across enterprise, start-up and sovereign markets. HUMAIN will oversee end-to-end delivery, including hyperscale data center, sustainable power systems, and global fiber interconnects, and AMD will provide the full spectrum of the AMD AI compute portfolio and the AMD ROCm open software ecosystem.

"At AMD, we have a bold vision to enable the future of AI everywhere—bringing open, high-performance computing to every developer, AI start-up and enterprise around the world," said Dr. Lisa Su, Chair and CEO, AMD. "Our investment with HUMAIN is a significant milestone in advancing global AI infrastructure. Together, we are building a globally significant AI platform that delivers performance, openness and reach at unprecedented levels." With initial deployments already underway across key global regions, the collaboration is on track to activate multi-exaflop capacity by early 2026, supported by next-gen AI silicon, modular data center zones, and a developer-enablement focused software platform stack built around open standards and interoperability.

AMD has reportedly decided to move its 4 nm chip orders from Samsung to TSMC's facilities in Arizona, United States. This is a significant loss for Samsung, as AMD had been working closely with Samsung on the SF4X process for EPYC server processors, Ryzen APUs, and Radeon graphics cards. It's worth noting that in May 2023, AMD announced the exact opposite—moving from TSMC to Samsung for some of its 4 nm CPUs. This partnership was an important part of AMD's strategy to use multiple manufacturers; however now appears to be failing. Reports indicate that AMD's decision comes from concerns about the stability and consistency of Samsung's manufacturing process, leading AMD to cancel plans for mass production of graphics chips using Samsung's 4 nm technology.

These changes in manufacturing strengthen TSMC's leading position in the chip manufacturing industry, even though relying on a single manufacturer creates geopolitical risks. AMD continues to deepen its relationship with TSMC, committing to use TSMC's advanced 2 nm technology for its upcoming "Venice" processors, which have completed testing at TSMC's Arizona facility and remain on schedule for release in 2026. Meanwhile, Samsung Electronics has reportedly achieved better-than-expected results in testing its SF2 (2 nm) process, with initial yields above 30%. The company plans to stabilize this process in the second half of 2025 to begin mass production of the Exynos 2600 mobile chip. Building on this progress, Samsung is reportedly close to securing an agreement to manufacture Qualcomm's Snapdragon 8 Elite 2 using its new 2 nm process.

Taiwan's electronics manufacturing services (EMS) providers are accelerating their North American production plans in response to tariff threats, but component shortages and capacity constraints at US chip plants could hamper the AI server market for years, according to industry sources.

"Since Trump's election, Taiwanese manufacturers have been strategically expanding their US presence," said Yen Chou, an analyst at DIGITIMES Research. "Most server manufacturers are concentrating in Texas, with Foxconn's FII already operating there and planning expansions."

Xbox players worldwide are facing sticker shock this week as Microsoft quietly implemented significant price increases across its latest hardware lineup and select first-party titles. The standard Xbox Series X with 1 TB of storage now carries a suggested retail price of $599.99, up from $499.99. The digital-only Series X has jumped to $549.99, and the special Galaxy Black 2 TB edition now lists at $729.99, compared with its original $599.99 launch price. Meanwhile, the more affordable Xbox Series S saw its 512 GB model climb from $299.99 to $379.99. A newly introduced 1 TB version of the Series S is now priced at $429.99. European customers will pay €349.99 for the base Series S and €599.99 for the standard Series X, while in the United Kingdom, those figures are £299.99 and £499.99, respectively.

Microsoft has also raised prices on accessories. The basic wireless controller increased from $59.99 to $64.99 in the U.S., and the Xbox Wireless Headset now costs $119.99 in North America. Some specialized peripherals, such as the Adaptive Controller and Adaptive Joystick, remain at their previous prices, relieving gamers needing those devices. On the software side, specific first-party titles launching this holiday season will carry a $79.99 price tag instead of the usual $69.99. Digital buyers will continue to benefit from Xbox Play Anywhere, which allows a single purchase to cover both console and PC versions at no extra charge. Importantly, Xbox Game Pass subscription fees are unchanged for now, even though Microsoft tweaked console and subscription pricing as recently as mid-2024 and made a minor adjustment in June 2023. In a statement, Xbox leadership acknowledged that these changes will be tough on fans. Still, the leadership said rising development, manufacturing, logistics costs, and ongoing trade-policy uncertainties drove them.

Today IBM announced plans to invest $150 billion in America over the next five years to fuel the economy and to accelerate its role as the global leader in computing. This includes an investment of more than $30 billion in research and development to advance and continue IBM's American manufacturing of mainframe and quantum computers.

"Technology doesn't just build the future—it defines it," said Arvind Krishna, IBM chairman, president and chief executive officer. "We have been focused on American jobs and manufacturing since our founding 114 years ago, and with this investment and manufacturing commitment we are ensuring that IBM remains the epicenter of the world's most advanced computing and AI capabilities."

TSMC is speeding up its plans to grow worldwide, the company's Chairman, C.C. Wei is announcing they'll start building their third and fourth fabs in Arizona later this year. This comes after TSMC finished constructing the second Arizona plant while the first fab started volume production in Q4 2024. TSMC wants to open its second factory about six months earlier than planned due to increasing customer demand. The first factory will make 4 nm chips, the second will target 3 nm chips, and the newer ones will work on even smaller N2 and A16 nodes. This rapid expansion is part of TSMC's additional $100 billion investment to build five more semiconductor plants and a research center in the U.S. In total, TSMC will invest $165 billion in the United States.

Besides its US operations, TSMC keeps pushing forward with its worldwide manufacturing plans. Wei dismissed rumors of setbacks at the company's upcoming Kumamoto plant in Japan. He confirmed that their first fab started mass production in late 2024, achieving excellent yields. They plan to begin building a second Japanese facility this year, once the infrastructure is ready. The company's European expansion in Dresden is also on track, with strong backing from both the European Commission and the German federal government. They broke ground at the Dresden site in August 2024 as Europe's first FinFET-capable dedicated foundry operation.

NVIDIA is working with its manufacturing partners to design and build factories that, for the first time, will produce NVIDIA AI supercomputers entirely in the U.S. Together with leading manufacturing partners, the company has commissioned more than a million square feet of manufacturing space to build and test NVIDIA Blackwell chips in Arizona and AI supercomputers in Texas. NVIDIA Blackwell chips have started production at TSMC's chip plants in Phoenix, Arizona. NVIDIA is building supercomputer manufacturing plants in Texas, with Foxconn in Houston and with Wistron in Dallas. Mass production at both plants is expected to ramp up in the next 12-15 months. The AI chip and supercomputer supply chain is complex and demands the most advanced manufacturing, packaging, assembly and test technologies. NVIDIA is partnering with Amkor and SPIL for packaging and testing operations in Arizona.

Within the next four years, NVIDIA plans to produce up to half a trillion dollars of AI infrastructure in the United States through partnerships with TSMC, Foxconn, Wistron, Amkor and SPIL. These world-leading companies are deepening their partnership with NVIDIA, growing their businesses while expanding their global footprint and hardening supply chain resilience. NVIDIA AI supercomputers are the engines of a new type of data center created for the sole purpose of processing artificial intelligence—AI factories that are the infrastructure powering a new AI industry. Tens of "gigawatt AI factories" are expected to be built in the coming years. Manufacturing NVIDIA AI chips and supercomputers for American AI factories is expected to create hundreds of thousands of jobs and drive trillions of dollars in economic security over the coming decades.

President Trump announced late Friday that a range of electronics imported from China will not be hit by his new reciprocal tariffs, according to a US Customs and Border Protection notice. The exemption, which applies to items arriving in the United States or leaving bonded warehouses on or after April 5, covers smartphones, computer monitors, semiconductors, various electronic parts, and, importantly, high-performance GPUs. Tech companies were bracing for big cost increases. Apple, for example, assembles about 90 percent of its iPhones in China and holds roughly six weeks of inventory in US warehouses. Without this exemption, consumers would likely have seen higher prices once that stock ran out. Framework, the modular laptop maker, has already paused US sales of some Laptop 13 models and discounted others by up to 12 percent after a new 10 percent tariff on Taiwanese parts squeezed their margins.

The GPU market got another break thanks to a clever workaround in the United States-Mexico-Canada Agreement. A research firm SemiAnalysis pointed out that graphics cards made in Taiwan can still enter the US tariff-free if they undergo final assembly in Mexico or Canada. That loophole applies to digital processing units and related circuit boards, which means companies relying on NVIDIA's top-tier accelerators for AI won't see an immediate price jump. White House Press Secretary Karoline Leavitt said these steps are part of a two-pronged plan: offering short-term relief to keep consumer prices down while at the same time pushing major tech firms like Apple, TSMC, and NVIDIA to invest billions in US manufacturing. However, many experts warn that high-precision components are still largely made in Asia, so building up domestic production capacity could take months or even years and may remain more expensive in the meantime.

Update: President Donald Trump posted on Truth Social the following: "There was no Tariff "exception" announced on Friday. These products are subject to the existing 20% Fentanyl Tariffs, and they are just moving to a different Tariff "bucket."We are taking a look at Semiconductors and the WHOLE ELECTRONICS SUPPLY CHAIN in the upcoming National Security Tariff Investigations."

High-performance GPUs manufactured in Taiwan could now enter the US market tariff-free through a technical loophole in the United States-Mexico-Canada Agreement (USMCA), found by a research firm SemiAnalysis. Companies can route Taiwan-made GPUs through assembly facilities in Mexico and Canada, effectively circumventing the 32% import duty that would otherwise apply to direct shipments from Taiwan. The exemption hinges on a Most-Favored-Nation clause within the USMCA framework that specifically classifies digital processing units (HTS 8471.50), automatic data processing machine units (HTS 8471.80), and their associated components (HTS 8473.30) as "originating goods." This classification applies regardless of manufacturing origin, creating a duty-free pathway for NVIDIA HGX boards, GB200 baseboards, and RTX GPU cards that undergo final assembly in North American facilities.

The strategy capitalizes on two complementary policy mechanisms. First, President Trump's March 7 executive orders maintained existing USMCA exemptions, preserving the duty-free status for compliant goods from Canada and Mexico. Second, the USMCA's expanded definition of originating products creates a classification framework that treats assembled servers and related components as North American products despite their core manufacturing in Taiwan. For US technology firms, the additional logistical complexity of cross-border assembly operations is offset by eliminating substantial import duties on these high-value components. This practice mirrors established protocols in agricultural imports, where products like Mexican avocados gain preferential treatment under similar origin rules. The global supply chain is adapting quickly, especially in high-margin areas like GPUs, which power AI workloads. We are yet to see how companies set up manufacturing and logistics in the new era of tariff-driven narrative.

Yesterday, United States President Donald Trump announced a set of tariffs imposed on US trading partners, imposing a series of 10%+ tariffs on partners, calling it a "Liberation Day." Today, we are calculating how much these tariffs will impact consumers and what is most important at TechPowerUp: semiconductors powering our GPUs and CPUs. According to one of the top investment banks, Goldman Sachs, semiconductors are exempt from the reciprocal tariffs that Trump has imposed on Taiwan. However, the semiconductor manufacturing equipment used by makers like TSMC is not exempt and is expected to be hit with the 32% tariffs. This is only half of what Taiwan imposes on imports of US-made goods. For TSMC, the number one maker of GPUs and CPUs, tariffs can be tricky to navigate. While its existing manufacturing facilities use equipment sourced from Dutch ASML and a few US companies like Lam Research and KLA Corporation, it shouldn't be a problem to ship new silicon to the US.

However, if TSMC wants to expand its manufacturing facilities in any country that is not the US, it will have to deal with 32% tariffs on US-sourced silicon manufacturing equipment. For EU-based ASML, things are looking a little different. If over 20% of the equipment is made up of US content, a tariff exemption might apply, potentially reducing import costs. If more than one-fifth of a product's components or value originates from US sources, the equipment may be eligible for tariff relief. ASML's machines include some US components, so determining whether these machines meet the 20% threshold is crucial. If they do, the tariff exemption could help lower costs associated with importing these advanced machines, reaching up to $380 million. For non-US-injected goods, EU entities are subject to 20% tariffs.

Charles Reed returns to Oakmont, a city drowning in supernatural mystery and eldritch terror—now fully remastered with Unreal Engine 5! Coming soon to PC, PS5 and Xbox Series, including a free upgrade for existing owners. Check out some more comparison screenshots in 4K! In the 1920s, on the East Coast of the United States, a half-submerged city is gripped by supernatural forces. You're a private investigator, uncovering the truth of what has possessed the city and corrupted the minds of its inhabitants... and yours.

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A recent study by TechInsights is reshaping the narrative around the cost of semiconductor manufacturing in the United States. According to the survey, processing a 300 mm wafer at TSMC's Fab 21 in Phoenix, Arizona, is only about 10% more expensive than similar operations in Taiwan. This insight challenges earlier assumptions based on TSMC founder Morris Chang's comments, which suggested that high fab-building expenses in Arizona made US chip production financially impractical. G. Dan Hutcheson of TechInsights highlighted that the observed cost difference largely reflects the expenses associated with establishing a brand-new facility. "It costs TSMC less than 10% more to process a 300 mm wafer in Arizona than the same wafer made in Taiwan," he explained. The initial higher costs stem from constructing a fab in an unfamiliar market with a new, sometimes unskilled workforce—a scenario not typical for mature manufacturing sites.

A significant portion of the wafer production cost is driven by equipment, which accounts for well over two-thirds of the total expenses. Leading equipment providers like ASML, Applied Materials, and Lam Research charge similar prices globally, effectively neutralizing geographic disparities. Although US labor costs are higher than in Taiwan, the heavy automation in modern fabs means that labor represents less than 2% of the overall cost. Additional logistics for Fab 21, including the return of wafers to Taiwan for dicing, testing, and packaging, add complexity but only minimally affect the overall expense. With plans to expand domestic packaging capabilities, TSMC's approach is proving to be strategically sound. This fresh perspective suggests that the apparent high cost of US fab construction has been exaggerated. TSMC's $100B investment in American semiconductor manufacturing reflects a calculated decision informed by detailed cost analysis—demonstrating that location-based differences become less significant when the equipment dominates expenses.

According to the International Data Corporation (IDC) Worldwide Quarterly Server Tracker, the server market reached a record $77.3 billion dollars in revenue during the last quarter of the year. This quarter showed the second highest growth rate since 2019 with a year-over-year increase of 91% in vendor revenue. Revenue generated from x86 servers increased 59.9% in 2024Q4 to $54.8 billion while Non-x86 servers increased 262.1% year over year to $22.5 billion.

Revenue for servers with an embedded GPU in the fourth quarter of 2024 grew 192.6% year-over-year and for the full year 2024, more than half of the server market revenue came from servers with an embedded GPU. NVIDIA continues dominating the server GPU space with over 90% of the total shipments with and embedded GPU in 2024Q4. The fast pace at which hyperscalers and cloud service providers have been adopting servers with embedded GPUs has fueled the server market growth which has more than doubled in size since 2020 with revenue of $235.7 billion dollars for the full year 2024.

When the US imposed sanctions on Chinese semiconductor makers, China began the push for sovereign chipmaking tools. According to a study conducted by the Emerging Technology Observatory (ETO), Chinese institutions have dramatically outpaced their US counterparts in next-generation chipmaking research. Between 2018 and 2023, nearly 475,000 scholarly articles on chip design and fabrication were published worldwide. Chinese research groups contributed 34% of the output—compared to just 15% from the United States and 18% from Europe. The study further emphasizes the quality of China's contributions. Focusing on the top 10% of the most-cited articles, Chinese researchers were responsible for 50% of this high-impact work, while American and European research accounted for only 22% and 17%, respectively.

This trend shows China's lead isn't about numbers only, and suggests that its work is resonating strongly within the global academic community. Key research areas include neuromorphic, optoelectric computing, and, of course, lithography tools. China is operating mainly outside the scope of US export restrictions that have, since 2022, shrunk access to advanced chipmaking equipment—precisely, tools necessary for fabricating chips below the 14 nm process node. Although US sanctions were intended to limit China's access to cutting-edge manufacturing technology, the massive body of Chinese research suggests that these measures might eventually prove less effective, with Chinese institutions continuing to push forward with influential, high-citation studies. However, Chinese theoretical work is yet to be proven in the field, as only a single company currently manufactures 7 nm and 5 nm nodes—SMIC. Chinese semiconductor makers still need more advanced lithography solutions to reach high-volume manufacturing on more advanced nodes like 3 nm and 2 nm to create more powerful domestic chips for AI and HPC.

On June 1, 1988, the very first Madden video game was released to the world. Players needed to load up either a Commodore 64/Commodore 128, Apple II, or MS-DOS to launch the game. When they did, they were greeted with 8-bit animations of the NFL's most popular teams and found themselves controlling their favorite players to try and win themselves a Super Bowl. And at that time, it was amazing. Thirty-seven years later and EA SPORTS hasn't stopped advancing Madden and our American Football games.

Most recently, we launched EA SPORTS Madden NFL 25 and College Football 25, which are tentpoles of our beloved American Football Ecosystem. Yet our football games are no longer blocky pixels and four-directional controls. They're among the most realistic sports simulation titles on the planet. We even celebrated the recent Super Bowl weekend with these titles and our very own Madden Bowl, featuring championship games and incredible music all in the heart of New Orleans. This is in no small part due to the incredible teams and their mission to make our games better every single year. And technology plays a critical role in making this happen.

Apple today announced its largest-ever spend commitment, with plans to spend and invest more than $500 billion in the U.S. over the next four years. This new pledge builds on Apple's long history of investing in American innovation and advanced high-skilled manufacturing, and will support a wide range of initiatives that focus on artificial intelligence, silicon engineering, and skills development for students and workers across the country.

"We are bullish on the future of American innovation, and we're proud to build on our long-standing U.S. investments with this $500 billion commitment to our country's future," said Tim Cook, Apple's CEO. "From doubling our Advanced Manufacturing Fund, to building advanced technology in Texas, we're thrilled to expand our support for American manufacturing. And we'll keep working with people and companies across this country to help write an extraordinary new chapter in the history of American innovation."

Three weeks after the launch of its GeForce RTX 5090 and RTX 5080 "Blackwell" GPUs, NVIDIA has introduced a "Verified Priority Access" scheme for North American customers. Approximately eighteen hours ago, the Tim@NVIDIA account posted an announcement on the company's official GeForce discussion forum: "we know it's challenging to purchase a GeForce RTX 50 Series graphics card...It will give a limited number of verified GeForce gamers & creators in the United States the opportunity to purchase one GeForce RTX 5090 or RTX 5080 Founders Edition graphics card from the NVIDIA Marketplace." Team Green graphics card enthusiasts have experienced less than ideal buying conditions since the end of January (2025)—Jensen & Co. have likely absorbed a massive dose of feedback and reacting accordingly, but many pundits will question the relatively late rollout of an anti-scalping system.

A previous iteration of NVIDIA's "Verified Priority Access" program was tested soon after the launch of GeForce RTX 40-series "Ada Lovelace" GPUs. Founders Edition cards are (normally) offered at baseline MSRP, but scalpers have swiftly depleted initial stock allocations. Team Green's revived program presents some strict conditions: "users who have an NVIDIA Account created on or before January 30th, 2025 at 6AM Pacific Time can submit their interest for Verified Priority Access through this form. If selected, users will be notified at the email address of the NVIDIA account they enrolled with. Invites will begin rolling out next week." The Team Green staffer stated that the scheme is—"at this time"—limited to GeForce RTX 5090 and RTX 5080 Founders Edition cards. It should be noted that the just launched GeForce RTX 5070 Ti GPU will not arrive in Founders Edition form; potential buyers will have to navigate a jagged landscape of AIB custom designs.

TSMC is set to hold its inaugural board meeting on US soil on February 12—a strategic decision influenced by potential reciprocal tariffs outlined by the US President Donald Trump. As the company's first wafer fabrication facility in Arizona is in mass production using its 4 nm process, the US board meeting marks a first in TSMC's global expansion, where the company is holding a board meeting outside of Taiwan for the first time in its four-decade history. The board gathering, which will bring together directors from its Taiwan headquarters and overseas operational sites, comes amid concerns over possible US tariff measures targeting key trade partners, including Taiwan. Trump recently hinted at imposing tariffs on semiconductor products, which could directly affects TSMC's business operations.

Among the attendees will be Liu Jingqing, a director representing Taiwan's National Development Fund Management Committee, the company's largest shareholder holding 1.65 billion shares. Liu, who left for the United States on February 8, is expected to return to Taiwan immediately after the meeting, ensuring the board remains aligned with upcoming legislative sessions. During the meeting, the board will review the financial results for the fourth quarter and decide on cash dividends for 2024. Despite uncertainties over US tariffs, TSMC continues to expand its US investments. Its second and third fabs in Arizona, expected to employ more advanced processes such as 3 nm and 2 nm, show the company's long-term commitment to the American market while it continues advancing process and packaging capacity in Taiwan. TSMC Chairman C.C. Wei stressed that advancing mass production in Taiwan remains critical even while expanding US operations.

3M is expanding its commitment to the semiconductor industry by joining the US-JOINT Consortium, a strategic partnership of 12 leading semiconductor suppliers. The consortium drives research and development in next-generation semiconductor advanced packaging and back-end processing technologies anchored by a new cutting-edge facility in Silicon Valley.

"As the demands of AI and other high performance computing technologies increase, suppliers must work together to provide comprehensive solutions to tough challenges on increasingly shorter timelines." said Steven Vander Louw, 3M's president of display and electronics product platforms. "The companies in the US-JOINT Consortium represent US and Japanese innovation leaders in a range of advanced packaging technologies. 3M is pleased to join the consortium in order to bring our decades of materials science expertise, across more than 50 technology platforms, to help address these challenges."

The United States, currently led by the Trump administration, could be preparing a surprise package to its close silicon ally—Taiwan. During a House GOP issues conference in Florida, US President Donald Trump announced that he would impose 25% to 100% tariffs on Taiwan-made chips, including the world's leading silicon manufacturer, TSMC. Trump addressed the conference, saying, "In the very near future, we are going to be placing tariffs on foreign production of computer chips, semiconductors, and pharmaceuticals to return production of these essential goods to the United States. They left us and went to Taiwan; we want them to come back. We do not want to give them billions of dollars like this ridiculous program that Biden has given everybody billions of dollars. They already have billions of dollars. […] They did not need money. They needed an incentive. And the incentive is going to be they [do not want to] pay a 25%, 50% or even a 100% tax."

The issue for TSMC is its massive reliance on US companies to drive revenue. The majority of its cutting-edge silicon is going to only a handful of companies, including Apple, NVIDIA, Qualcomm, and Broadcom. With tariffs, the supply chain economics, especially in the world of semiconductors, will break. TSMC's most significant export country is the US, and US companies with trillions of US Dollars of market capitalization rely on Taiwanese silicon. As a result, TSMC will most likely raise its wafer prices, with results trickling down to US companies raising their product prices with additional price hikes. TSMC plans to bring its advanced manufacturing on American soil, but given that these tariffs might break the economic model it currently operates under, it may need to happen sooner. Taiwan-based silicon giant has planned to leave US facilities trailing behind by a generation or two of advanced manufacturing, while domestic facilities produce the newest nodes. If Trump decides to go through tariffs, TSMC could make additional changes to its US-based manufacturing plans.

On Tuesday, the newly inaugurated United States president, Donald Trump, announced a massive AI infrastructure expansion in the US called Stargate Project. Stargate is an idea that brings private investments across the US land, with up to 500 billion US dollars committed to the project over the next four years. This is single-handedly one of the most significant infrastructure projects ever planned, and this time it is all about AI and data centers. The initial phase involves deploying 100 billion US Dollars immediately, while the remaining 400 billion will be deployed periodically over the next four years. OpenAI and SoftBank are leading this project, with Softbank's CEO Masayoshi Son being the project's chairman. Major equity partners include SoftBank, OpenAI, Oracle, and MGX. Major technology partners who will supply the know-how, planning, software, and hardware are Arm, Microsoft, NVIDIA, Oracle, and OpenAI.

Leading the entire operation will be up to OpenAI, who is gaining operational lead in the project, while Softbank oversees financial planning. Interestingly, the buildout has already begun. OpenAI is currently exploring a few sites in Abilene, Texas, which includes ten 500,000 sq. ft. data centers with 20 planned for the future. Interestingly, the infrastructure expansion will most likely be present in every US state that can provide ample land and power capacity. OpenAI is looking for partners to help with the massive data centers' power, land, and construction. The most significant impact of this project will be on the power grid, which will require additional buildout and implementation of small nuclear reactors running locally nearby to satisfy the power draw from hundreds of thousands and even millions of GPUs. OpenAI is praising NVIDIA for its almost decade-long partnership, meaning that most GPUs will likely be NVIDIA-sourced.

GlobalFoundries (Nasdaq: GFS) (GF) today announced plans to create a new center for advanced packaging and testing of U.S.-made essential chips within its New York manufacturing facility. Supported by investments from the State of New York and the U.S. Department of Commerce, the first-of-its-kind center aims to enable semiconductors to be securely manufactured, processed, packaged and tested entirely onshore in the United States to meet the growing demand for GF's silicon photonics and other essential chips needed for critical end markets including AI, automotive, aerospace and defense, and communications.

Growth in AI is driving the adoption of silicon photonics and 3D and heterogeneously integrated (HI) chips to meet power, bandwidth and density requirements in datacenters and edge devices. Silicon photonics chips are also positioned to address power and performance needs in automotive, communications, radar, and other critical infrastructure applications.

Today, the U.S. Department of Commerce has announced that CHIPS National Advanced Packaging Manufacturing Program (NAPMP) has finalized $1.4 billion in award funding to bolster U.S. leadership in advanced packaging and enable new technologies to be validated and transitioned at scale to U.S. manufacturing. These awards will help establish a self-sustaining, high-volume, domestic, advanced packaging industry where advanced node chips are both manufactured and packaged in the United States.

These awards include:

• A total of $300 million under the CHIPS NAPMP's first Notice of Funding Opportunity (NOFO) for advanced substrates and material research to Absolics Inc., Applied Materials Inc., and Arizona State University. This follows the previously announced intent to enter negotiations on November 21, 2024
• $1.1 billion to Natcast to operate the advanced packaging capabilities of the CHIPS for America NSTC Prototyping and NAPMP Advanced Packaging Piloting Facility (PPF). This follows the previously announced CHIPS R&D Facilities Model on July 12, 2024, and planned site selection for the PPF on January 6, 2025

European tech brand ENDORFY is making its first official appearance at CES 2025 in Las Vegas. Running through January 9, the company will showcase its latest PC components and peripherals to a global audience at the world's most influential tech event.

ENDORFY is expanding to the US market with a portfolio of high-quality PC components and accessories. This expansion supports the company's goal of reaching all modern technology enthusiasts with a range of products praised for combining advanced technology with reliability, efficiency, and great value for gamers, content creators, and tech enthusiasts.